DATE: Dark clouds gather over 3D integration, panelist tells conference
The chip industry could face problems as the foundry business and the packaging industry struggle for control of 3D integration technologies, Naveed Sherwani, president of Open-Silicon, told the DATE...
View Article3D-IC cooling ascends the agenda
DARPA, the US defense research agency, believes that the heat dissipation requirements in stacked 3D-ICs could be as high as one kilowatt per square centimeter in an overall IC, and five kilowatts per...
View ArticleDAC 2013 Preview VII: Verification and simulation
DAC 2013’s technical program has four sessions on verification clustered on Wednesday and Thursday. With an increasing number of companies augmenting their tool flows with in-house enhancements...
View ArticleAltera outlines process roadmap for ‘Gen 10’ FPGAs
Altera has disclosed a number of the features that will make it into the top end of its upcoming ‘Generation 10’ family of field-programmable gate arrays (FPGAs), which will be made on either the 14nm...
View Article3D-IC focus for GSA’s Taipei Memory+ event next week
The GSA Memory+ Conference takes place on Thursday October 31 at The Regent Hotel in Taipei, Taiwan and looks like an event well worth checking out for anyone looking at the challenges of 3D-IC....
View ArticleClik here to view.
Amkor keeps question mark next to ‘full’ 3D-IC in 2016
3D-IC projects today are on yields of at best between 95% and 96%, according to leading packaging player Amkor Technology. The market is looking – as it always does – for ‘three nines’. Dr Choon-Heung...
View ArticleClik here to view.
TSMC demonstrates readiness for 3D-IC
One of the more interesting things about 3D-IC is how much of it is about scaling up – about as counter-intuitive a phrase as you can get in silicon design. Though obvious when you think about what we...
View ArticleClik here to view.
TSMC succession plan emphasizes stability
The immediate appointments of TSMC veterans Dr Mark Liu and Dr C.C. Wei as president and co-CEOs of the world’s largest foundry may seem unusual. But they were widely expected among analysts and...
View ArticleIntel and Altera extend foundry deal into interposer and full 3D
Altera has extended its foundry agreement with Intel to cover future 3D-IC development, effectively quashing rumors that it was about to move its most advanced production back to TSMC. Intel originally...
View ArticleGary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL
The 2014 Market Share Summary from Gary Smith EDA (GSEDA) points to renewed growth in the PCB design tool market as design specifications increasingly adopt forms of multi-die integration as well as...
View Article
